Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715689 | Method of forming metal interconnection | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-08-01 |
| 11551967 | Via structure and methods for forming the same | Meng-Pei Lu, Ming-Han Lee, Shin-Yi Yang | 2023-01-10 |