Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682616 | Semiconductor structure and method for forming the same | Shin-Yi Yang, Shu-Wei Li, Chin-Lung Chung, Ming-Han Lee | 2023-06-20 |
| 11551967 | Via structure and methods for forming the same | Ming-Han Lee, Shin-Yi Yang, Tz-Jun Kuo | 2023-01-10 |