Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682616 | Semiconductor structure and method for forming the same | Meng-Pei Lu, Shin-Yi Yang, Chin-Lung Chung, Ming-Han Lee | 2023-06-20 |
| 11682620 | Graded metallic liner for metal interconnect structures and methods for forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2023-06-20 |
| 11670595 | Semiconductor device structure and methods of forming the same | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-06-06 |
| 11652055 | Interconnect structure with hybrid barrier layer | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-05-16 |
| 11640940 | Methods of forming interconnection structure including conductive graphene layers | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-05-02 |
| 11605591 | Semiconductor device structure and methods of forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2023-03-14 |