Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682620 | Graded metallic liner for metal interconnect structures and methods for forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2023-06-20 |
| 11605591 | Semiconductor device structure and methods of forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2023-03-14 |