Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682616 | Semiconductor structure and method for forming the same | Meng-Pei Lu, Shin-Yi Yang, Shu-Wei Li, Ming-Han Lee | 2023-06-20 |
| 11605558 | Integrated circuit interconnect structure having discontinuous barrier layer and air gap | Shin-Yi Yang, Ming-Han Lee | 2023-03-14 |