Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854898 | Wrap-around contact on FinFET | Sung-Li Wang, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang +5 more | 2023-12-26 |
| 11784183 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Clement Hsingjen Wann | 2023-10-10 |