Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854898 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin +5 more | 2023-12-26 |
| 11784183 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Neng-Kuo Chen | 2023-10-10 |
| 11764284 | Semiconductor device with reduced trap defect and method of forming the same | Chun Hsiung Tsai, Kuo-Feng Yu, Yu-Ming Lin | 2023-09-19 |
| 11742237 | Mechanism for FinFET well doping | Chun Hsiung Tsai, Yan-Ting Lin | 2023-08-29 |
| 11688787 | Semiconductor device having modified profile metal gate | Yu-Lien Huang, Chi-Wen Liu, Ming-Huan Tsai, Zhao-Cheng Chen | 2023-06-27 |
| 11676867 | Method for manufacturing semiconductor structure | Chun Hsiung Tsai, Cheng-Yi Peng, Ching-Hua Lee, Yu-Ming Lin | 2023-06-13 |
| 11664456 | Semiconductor structures and methods of forming thereof | Cheng-Hsien Wu, Chih-Hsin Ko | 2023-05-30 |
| 11658230 | Method for forming a semiconductor structure including plasma cleaning operations | Chun Hsiung Tsai, Ru-Shang Hsiao | 2023-05-23 |
| 11568122 | Integrated circuit fin layout method | Po-Hsiang Huang, Fong-Yuan Chang, Chih-Hsin Ko, Sheng-Hsiung Chen, Li-Chun Tien +1 more | 2023-01-31 |