Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854898 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin +5 more | 2023-12-26 |
| 11855210 | Method for fabricating a strained structure and structure formed | Tsung-Lin Lee, Chih-Hao Chang, Feng Yuan, Jeff J. Xu | 2023-12-26 |
| 11664456 | Semiconductor structures and methods of forming thereof | Cheng-Hsien Wu, Clement Hsingjen Wann | 2023-05-30 |
| 11568122 | Integrated circuit fin layout method | Po-Hsiang Huang, Fong-Yuan Chang, Clement Hsingjen Wann, Sheng-Hsiung Chen, Li-Chun Tien +1 more | 2023-01-31 |
| 11557650 | Semiconductor device and manufacturing method thereof | Chun Hsiung Tsai, Clement Hsing Jen Wann, Ya-Yun Cheng | 2023-01-17 |