Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854898 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Gin-Chen Huang +5 more | 2023-12-26 |
| 11817404 | Post passivation interconnect | Alan KUO, C. C. Chang, Yu-Lung Shih | 2023-11-14 |