Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784183 | Inter-level connection for multi-layer structures | Clement Hsingjen Wann, Neng-Kuo Chen | 2023-10-10 |
| 11721761 | Structure and method for providing line end extensions for fin-type active regions | Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang +2 more | 2023-08-08 |