Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854870 | Etch method for interconnect structure | Yu-Fang Huang, Kuo-Ju Chen, Ying-Liang Chuang, Chun-Neng Lin, Ming-Hsi Yeh +1 more | 2023-12-26 |
| 11587875 | Connecting structure and method for forming the same | U-Ting Chiu, Yu-Shih Wang, Yu-Fang Huang, Chun-Neng Lin, Ming-Hsi Yeh | 2023-02-21 |