Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854870 | Etch method for interconnect structure | Chun-Cheng Chou, Yu-Fang Huang, Kuo-Ju Chen, Chun-Neng Lin, Ming-Hsi Yeh +1 more | 2023-12-26 |
| 11854903 | Footing removal in cut-metal process | Ming-Chi Huang, Kuo-Bin Huang, Ming-Hsi Yeh | 2023-12-26 |
| 11810978 | Gate resistance improvement and method thereof | Ju-Li Huang, Hsin-Che Chiang, Yu-Chi Pan, Chun-Ming Yang, Chun-Sheng Liang +1 more | 2023-11-07 |
| 11715670 | FIN field-effect transistor and method of forming the same | Yu-Chi Pan, Kuo-Bin Huang, Ming-Hsi Yeh, Yu-Te Su, Kuan-Wei Lin | 2023-08-01 |
| 11682669 | Metal gate structure and methods thereof | Ming-Chi Huang, Ming-Hsi Yeh, Kuo-Bin Huang | 2023-06-20 |
| 11658225 | Fin field-effect transistor and method of forming the same | Yu-Chi Pan, Ming-Hsi Yeh, Kuo-Bin Huang | 2023-05-23 |