Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855193 | Fin field-effect transistor device and method of forming the same | Jian-Jou Lian, Ming-Hsi Yeh, Chieh-Wei Chen, Tzu-Ang Chiang | 2023-12-26 |
| 11854870 | Etch method for interconnect structure | Chun-Cheng Chou, Yu-Fang Huang, Kuo-Ju Chen, Ying-Liang Chuang, Ming-Hsi Yeh +1 more | 2023-12-26 |
| 11848239 | Patterning method and structures resulting therefrom | Chieh-Wei Chen, Jian-Jou Lian, Tzu-Ang Chiang, Ming-Hsi Yeh | 2023-12-19 |
| 11817330 | Method for processing substrate | Po-Yuan Wang, Tzu-Ang Chiang, Jian-Jou Lian, Yu-Shih Wang, Ming-Hsi Yeh | 2023-11-14 |
| 11749753 | Methods of forming a semiconductor device with a gate structure having a dielectric protection layer | Jian-Jou Lian, Ming-Hsi Yeh | 2023-09-05 |
| 11735425 | Fin field-effect transistor and method of forming the same | Tzu-Ang Chiang, Ming-Hsi Yeh, Jian-Jou Lian, Po-Yuan Wang, Chieh-Wei Chen | 2023-08-22 |
| 11587875 | Connecting structure and method for forming the same | U-Ting Chiu, Yu-Shih Wang, Chun-Cheng Chou, Yu-Fang Huang, Ming-Hsi Yeh | 2023-02-21 |
| 11588041 | Fin field-effect transistor and method of forming the same | Jian-Jou Lian, Tzu-Ang Chiang, Ming-Hsi Yeh, Po-Yuan Wang, Chieh-Wei Chen | 2023-02-21 |