Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848231 | Method for forming semiconductor device with multi-layer etch stop structure | Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin, Su-Jen Sung | 2023-12-19 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo +1 more | 2023-10-03 |
| 11676855 | Patterning interconnects and other structures by photo-sensitizing method | Wei-Jen Lo, Syun-Ming Jang, Tze-Liang Lee | 2023-06-13 |