Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848231 | Method for forming semiconductor device with multi-layer etch stop structure | Po-Cheng Shih, Tze-Liang Lee, Yu-Kai Lin, Su-Jen Sung | 2023-12-19 |
| 11769693 | Metal-based etch-stop layer | Szu-Ping Tung, Yu-Kai Lin, Shing-Chyang Pan | 2023-09-26 |
| 11670546 | Semiconductor structure and manufacturing method thereof | Yu-Kai Lin, Su-Jen Sung, Tze-Liang Lee | 2023-06-06 |
| 11658064 | Interconnect structure with dielectric cap layer and etch stop layer stack | Chao-Chun Wang | 2023-05-23 |
| 11651993 | Etch stop layer for semiconductor devices | Szu-Ping Tung, Shing-Chyang Pan | 2023-05-16 |