Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848231 | Method for forming semiconductor device with multi-layer etch stop structure | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Su-Jen Sung | 2023-12-19 |
| 11769693 | Metal-based etch-stop layer | Szu-Ping Tung, Jen Hung Wang, Shing-Chyang Pan | 2023-09-26 |
| 11670546 | Semiconductor structure and manufacturing method thereof | Su-Jen Sung, Tze-Liang Lee, Jen Hung Wang | 2023-06-06 |