Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848231 | Method for forming semiconductor device with multi-layer etch stop structure | Po-Cheng Shih, Tze-Liang Lee, Jen Hung Wang, Yu-Kai Lin | 2023-12-19 |
| 11670546 | Semiconductor structure and manufacturing method thereof | Yu-Kai Lin, Tze-Liang Lee, Jen Hung Wang | 2023-06-06 |