Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804410 | Thin-film non-uniform stress evaluation | Wei-De Ho, Han-Wei Wu, Pei-Sheng TANG, Meng-Jung Lee, Hua-Tai Lin +1 more | 2023-10-31 |
| 11769693 | Metal-based etch-stop layer | Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan | 2023-09-26 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Chun-Kai Chen, Tze-Liang Lee, Yi-Nien Su | 2023-08-01 |
| 11682624 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2023-06-20 |
| 11651993 | Etch stop layer for semiconductor devices | Jen Hung Wang, Shing-Chyang Pan | 2023-05-16 |