Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11796922 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Huicheng Chang, Chia-Cheng Chen, Jyu-Horng Shieh, Liang-Yin Chen +7 more | 2023-10-24 |
| 11735469 | Method of forming a semiconductor device | Shu-Huei Suen, Jyu-Horng Shieh, Ru-Gun Liu | 2023-08-22 |
| 11728209 | Lithography method to reduce spacing between interconnect wires in interconnect structure | Yu-Yu Chen | 2023-08-15 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Szu-Ping Tung, Chun-Kai Chen, Tze-Liang Lee | 2023-08-01 |
| 11710657 | Middle-of-line interconnect structure having air gap and method of fabrication thereof | Jyu-Horng Shieh | 2023-07-25 |