Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842922 | Method for forming interconnect structure | Jei-Ming Chen, Tze-Liang Lee | 2023-12-12 |
| 11715640 | Patterning material including silicon-containing layer and method for semiconductor device fabrication | Szu-Ping Tung, Tze-Liang Lee, Yi-Nien Su | 2023-08-01 |