Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851749 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Ya-Lien Lee, Hung-Wen Su | 2023-12-26 |
| 11830742 | Selective capping processes and structures formed thereby | Pei-Hsuan Lee, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2023-11-28 |
| 11791206 | Method for forming semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Pei-Hsuan Lee, Szu-Hua Wu | 2023-10-17 |
| 11777035 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2023-10-03 |
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11682624 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2023-06-20 |
| 11652044 | Contact structure and method of making | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chi-Feng Lin | 2023-05-16 |