Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Chih-Hsiang Chang +4 more | 2023-08-29 |
HP
Hsin-Ying Peng
Overall (2023): #420,491 of 537,848Top 80%
1
Patents 2023