Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Yen-Chun Lin, Hsin-Ying Peng, Chih-Hsiang Chang +4 more | 2023-08-29 |
| 11626268 | Induction coil assembly and reaction chamber | Gang Wei, Hengyi Su, Jing Yang | 2023-04-11 |