Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830742 | Selective capping processes and structures formed thereby | Chih-Chien Chi, Hung-Wen Su, Hsiao-Kuan Wei, Jui-Fen Chien, Hsin-Yun Hsu | 2023-11-28 |
| 11791206 | Method for forming semiconductor device | Jung-Tang Wu, Pao-Sheng Chen, Szu-Hua Wu, Chih-Chien Chi | 2023-10-17 |
| 11783469 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2023-10-10 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Chia-Hung Liu | 2023-09-12 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11730816 | Debranching enzyme modified starch, the preparing method and use thereof in hard capsule production | Ruei-Jan Chang, Hsin-Yi Chao, Wei-Yu Chen | 2023-08-22 |