Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764127 | Semiconductor package and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Chien Ling Hwang, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |