Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764127 | Semiconductor package and manufacturing method thereof | Jen-Chun Liao, Sung-Yueh Wu, Ching-Hua Hsieh | 2023-09-19 |
| 11756872 | Package structure and manufacturing method thereof | Sung-Yueh Wu, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu | 2023-09-12 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11721555 | Method and system for thinning wafer thereof | Bor-Ping Jang, Hsin-Hung Liao, Chung-Shi Liu | 2023-08-08 |
| 11631652 | Method and apparatus for bonding semiconductor substrate | Ying-Jui Huang, Ching-Hua Hsieh, Chia-Sheng Huang | 2023-04-18 |