Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721555 | Method and system for thinning wafer thereof | Chien Ling Hwang, Hsin-Hung Liao, Chung-Shi Liu | 2023-08-08 |
BJ
Bor-Ping Jang
Overall (2023): #503,884 of 537,848Top 95%
1
Patents 2023