Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765845 | Electronic apparatus with mounting mechanism | Chih-Hsuan Lin | 2023-09-19 |
| 11631652 | Method and apparatus for bonding semiconductor substrate | Ching-Hua Hsieh, Chien Ling Hwang, Chia-Sheng Huang | 2023-04-18 |
| 11556161 | Power delivery system with charging current limiting | Donghwi Kim, Geo John Palakunnel | 2023-01-17 |