Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742290 | Interconnect structure and method of forming thereof | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2023-08-29 |
| 11652044 | Contact structure and method of making | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi | 2023-05-16 |