Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854872 | Semiconductor device structure with interconnect structure and method for forming the same | Chun-Hao Kung, Chih-Chieh Chang, Hui-Chi Huang, Kei-Wei Chen | 2023-12-26 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang, Ting-Hsun Chang +7 more | 2023-06-20 |