HY

Hung Yen

TSMC: 2 patents #1,466 of 4,064Top 40%
Overall (2023): #149,737 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11772228 Chemical mechanical polishing apparatus including a multi-zone platen Ting-Hsun Chang, Chi-Hsiang Shen, Fu-Ming Huang, Chun-Chieh Lin, Tsung-Hsien Chang +4 more 2023-10-03
11658065 Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more 2023-05-23