Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855142 | Supportive layer in source/drains of FinFET devices | Jung-Chi Tai, Chii-Horng Li, Yen-Ru Lee, Yan-Ting Lin, Chih-Yun Chin | 2023-12-26 |
| 11854901 | Semiconductor method and device | Cheng-Hsiung Yen, Ta-Chun Ma, Chien-Chang Su, Jung-Jen Chen, Chii-Horng Li +1 more | 2023-12-26 |
| 11798984 | Seamless gap fill | Yen-Chun Huang, Bor Chiuan Hsieh, Tai-Chun Huang, Tze-Liang Lee | 2023-10-24 |
| 11735668 | Interfacial layer between fin and source/drain region | Chih-Yun Chin, Chii-Horng Li, Chien-Wei Lee, Hsueh-Chang Sung, Heng-Wen Ting +5 more | 2023-08-22 |
| 11710781 | Growth process and methods thereof | Pin-Chu Liang, Hung-Yao Chen | 2023-07-25 |
| 11710777 | Semiconductor device and method for manufacture | Chia-Ao Chang, De-Wei Yu, Chii-Horng Li, Yee-Chia Yeo, Hsueh-Chang Sung | 2023-07-25 |
| 11581425 | Method for manufacturing semiconductor structure with enlarged volumes of source-drain regions | Tsung-Hsi Yang, Che-Yu Lin, Yi-Fang Pai, Chii-Horng Li, Yee-Chia Yeo | 2023-02-14 |