BH

Bor Chiuan Hsieh

TSMC: 2 patents #1,466 of 4,064Top 40%
Overall (2023): #171,042 of 537,848Top 35%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11842930 Gap patterning for metal-to-source/drain plugs in a semiconductor device Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin, Fu-Sheng Li, Tsai-Jung Ho +2 more 2023-12-12
11798984 Seamless gap fill Yen-Chun Huang, Pei-Ren Jeng, Tai-Chun Huang, Tze-Liang Lee 2023-10-24