Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Jeng-Shien Hsieh +1 more | 2023-11-28 |
| 11729099 | Scalable E2E network architecture and components to support low latency and high throughput | Vahid Tabatabaee, Niranjan Vaidya, Mark Griswold | 2023-08-15 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2023-01-24 |