Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658157 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | Hui Yu Lee, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu | 2023-05-23 |
| 11562926 | Package structure and method of forming thereof | Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2023-01-24 |