Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837564 | Semiconductor bonding structure | Chun-Lin Lu, Shou-Zen Chang, Ying-Tsung Chu | 2023-12-05 |
| 11824099 | Source/drains in semiconductor devices and methods of forming thereof | Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu | 2023-11-21 |
| 11721752 | Semiconductor device having doped seed layer and method of manufacturing the same | Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai, Ru-Liang Lee | 2023-08-08 |
| 11594413 | Semiconductor structure having sets of III-V compound layers and method of forming | Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai | 2023-02-28 |
| 11594606 | Method of implanting dopants into a group III-nitride structure and device formed | Han-Chin Chiu, Chung-Yi Yu, Chen-Hao Chiang | 2023-02-28 |
| 11551927 | High electron mobility transistor (HEMT) having an indium-containing layer and method of manufacturing the same | Po-Chun Liu, Chung-Chieh Hsu, Chung-Yi Yu, Chen-Hao Chiang, Min-Chang Ching | 2023-01-10 |