Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832520 | Voltage breakdown uniformity in piezoelectric structure for piezoelectric devices | Chih-Ming Chen, Chiao-Chun Hsu | 2023-11-28 |
| 11824099 | Source/drains in semiconductor devices and methods of forming thereof | Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu | 2023-11-21 |
| 11824077 | Capping structure to reduce dark current in image sensors | Po-Chun Liu, Eugene Chen | 2023-11-21 |
| 11814731 | Semiconductor tool having controllable ambient environment processing zones | Chiao-Chun Hsu, Chih-Ming Chen, Sheng-Hsun Lu | 2023-11-14 |
| 11784204 | Enhanced trench isolation structure | Min-Ying Tsai, Cheng-Te Lee, Rei-Lin Chu, Ching-I Li | 2023-10-10 |
| 11721752 | Semiconductor device having doped seed layer and method of manufacturing the same | Chi-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai, Ru-Liang Lee | 2023-08-08 |
| 11713241 | Packaging method and associated packaging structure | Chih-Ming Chen, Yuan-Chih Hsieh | 2023-08-01 |
| 11688717 | Mechanical wafer alignment detection for bonding process | Ching-Hung Wang, Yeong-Jyh Lin, Ching-I Li, Tzu Wei Yu | 2023-06-27 |
| 11652058 | Substrate loss reduction for semiconductor devices | Xin-Hua Huang, Kuei-Ming Chen | 2023-05-16 |
| 11594606 | Method of implanting dopants into a group III-nitride structure and device formed | Han-Chin Chiu, Chi-Ming Chen, Chen-Hao Chiang | 2023-02-28 |
| 11594593 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Rei-Lin Chu | 2023-02-28 |
| 11594413 | Semiconductor structure having sets of III-V compound layers and method of forming | Chi-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2023-02-28 |
| 11551927 | High electron mobility transistor (HEMT) having an indium-containing layer and method of manufacturing the same | Po-Chun Liu, Chung-Chieh Hsu, Chi-Ming Chen, Chen-Hao Chiang, Min-Chang Ching | 2023-01-10 |