Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854999 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Ping-Yin Liu | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2023-12-26 |
| 11851318 | MEMS device and method for making the same | Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Wei-Chu Lin | 2023-12-26 |
| 11841791 | Code change request aggregation for a continuous integration pipeline | Wen Tao Zhang, Hong Jun Tu, Yiwen Huang, Yang Yang, YE CUI +3 more | 2023-12-12 |
| 11818944 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Yu-Hsing Chang, Yeong-Jyh Lin | 2023-11-14 |
| 11742321 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2023-08-29 |
| 11721637 | Patterning a transparent wafer to form an alignment mark in the transparent wafer | Ping-Yin Liu | 2023-08-08 |
| 11652058 | Substrate loss reduction for semiconductor devices | Chung-Yi Yu, Kuei-Ming Chen | 2023-05-16 |
| 11620041 | Reminder notifications for messages | Cécile Boucheron, Ganna Isayeva, Kathy Q. Kong, Sharvari Nerurkar, Archil Vardidze +1 more | 2023-04-04 |
| 11621186 | Simultaneous bonding approach for high quality wafer stacking applications | Ping-Yin Liu, Chang-Chen Tsao | 2023-04-04 |