HL

Hung-Hua Lin

TSMC: 4 patents #825 of 4,064Top 25%
Overall (2023): #47,388 of 537,848Top 9%
4
Patents 2023

Issued Patents 2023

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11854795 Integrate rinse module in hybrid bonding platform Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more 2023-12-26
11827513 Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng 2023-11-28
11812664 Pizoelectric MEMS device with electrodes having low surface roughness Yi-Ren Wang, Yuan-Chih Hsieh 2023-11-07
11634318 MEMs using outgassing material to adjust the pressure level in a cavity Yuan-Chih Hsieh 2023-04-25