Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2023-12-26 |
| 11814283 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yi-Ren Wang | 2023-11-14 |
| 11812664 | Pizoelectric MEMS device with electrodes having low surface roughness | Yi-Ren Wang, Hung-Hua Lin | 2023-11-07 |
| 11767216 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2023-09-26 |
| 11713241 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2023-08-01 |
| 11697588 | Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature | Yi-Ren Wang, Shing-Chyang Pan | 2023-07-11 |
| 11634318 | MEMs using outgassing material to adjust the pressure level in a cavity | Hung-Hua Lin | 2023-04-25 |
| 11542153 | Segmented pedestal for mounting device on chip | Lee-Chuan Tseng | 2023-01-03 |