Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11844226 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsun-Chung Kuang, Cheng-Yuan Tsai, Hai-Dang Trinh | 2023-12-12 |
| 11800823 | Method for manufacturing thermal dispersion layer in programmable metallization cell | Fa-Shen Jiang | 2023-10-24 |
| 11767216 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Jung-Huei Peng, Yi-Chien Wu | 2023-09-26 |
| 11758830 | Memory device structure with protective element | Hai-Dang Trinh, Cheng-Yuan Tsai | 2023-09-12 |
| 11716915 | Top-electrode barrier layer for RRAM | Chii-Ming Wu, Fa-Shen Jiang | 2023-08-01 |
| 11683999 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Cheng-Yuan Tsai, Wen-Ting Chu | 2023-06-20 |
| 11665909 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsun-Chung Kuang, Cheng-Yuan Tsai, Hai-Dang Trinh | 2023-05-30 |
| 11637240 | Semiconductor structure and method for forming the same | Fu-Ting Sung, Ching Ju Yang, Chii-Ming Wu | 2023-04-25 |
| 11637239 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Cheng-Yuan Tsai, Chin-Chieh Yang, Yu-Wen Liao, Wen-Ting Chu +1 more | 2023-04-25 |
| 11594593 | Method to reduce breakdown failure in a MIM capacitor | Chii-Ming Wu, Chia-Shiung Tsai, Chung-Yi Yu, Rei-Lin Chu | 2023-02-28 |