Issued Patents 2023
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855109 | Image sensor device and method | Yen-Chang Chu, Yeur-Luen Tu | 2023-12-26 |
| 11844226 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-12-12 |
| 11778931 | Diffusion barrier layer in programmable metallization cell | Albert Zhong, Hai-Dang Trinh, Shing-Chyang Pan | 2023-10-03 |
| 11758830 | Memory device structure with protective element | Hai-Dang Trinh, Hsing-Lien Lin | 2023-09-12 |
| 11735635 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Lan-Lin Chao | 2023-08-22 |
| 11737280 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Tzu-Yu Lin, Yi Yang Wei, Hai-Dang Trinh, Hsun-Chung Kuang | 2023-08-22 |
| 11723212 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Hsun-Chung Kuang | 2023-08-08 |
| 11721794 | Method for manufacturing reflective structure | Chia-Hua Lin, Yao-Wen Chang, Chii-Ming Wu, Eugene Chen, Tzu-Chung Tsai | 2023-08-08 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Kuo-Ming Wu | 2023-08-01 |
| 11716913 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Tzu-Chung Tsai, Fa-Shen Jiang | 2023-08-01 |
| 11705470 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Hsien Chou, Keng-Yu Chou, Yeur-Luen Tu | 2023-07-18 |
| 11682652 | Notched wafer and bonding support structure to improve wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen | 2023-06-20 |
| 11683999 | Switching layer scheme to enhance RRAM performance | Hai-Dang Trinh, Hsing-Lien Lin, Wen-Ting Chu | 2023-06-20 |
| 11670584 | Semiconductor structure with ultra thick metal and manufacturing method thereof | Chen-Fa Lu, Ching-Chung Hsu, Chung-Long Chang | 2023-06-06 |
| 11670539 | Method of making a semiconductor arrangement | Ming-Che Lee, Sheng-Chau Chen, Cheng-Hsien Chou | 2023-06-06 |
| 11665909 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-05-30 |
| 11664411 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, Sheng-Chau Chen, I-Nan Chen, Cheng-Hsien Chou | 2023-05-30 |
| 11637239 | High yield RRAM cell with optimized film scheme | Trinh Hai Dang, Hsing-Lien Lin, Chin-Chieh Yang, Yu-Wen Liao, Wen-Ting Chu +1 more | 2023-04-25 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Kuo-Ming Wu, Sheng-Chan Li | 2023-03-21 |
| 11594678 | Diffusion barrier layer in programmable metallization cell | Albert Zhong, Hai-Dang Trinh, Shing-Chyang Pan | 2023-02-28 |
| 11581254 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Sheng-Chan Li | 2023-02-14 |
| 11575021 | Surface treatment and passivation for high electron mobility transistors | Han-Chin Chiu | 2023-02-07 |
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Sheng-Chau Chen | 2023-01-10 |
| 11545202 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hsun-Chung Kuang, Hai-Dang Trinh | 2023-01-03 |
| 11545395 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Kuo-Ming Wu, Hau-Yi Hsiao | 2023-01-03 |