Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749760 | Composite etch stop layers for sensor devices | Cheng-Han Lin, Chao-Ching Chang, Yi-Ming Lin, Yen-Ting Chou, Yen-Chang Chen +1 more | 2023-09-05 |
| 11735624 | Multi-lateral recessed MIM structure | Alexander Kalnitsky, Ru-Liang Lee, Ming Chyi Liu, Sheng-Chau Chen | 2023-08-22 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai, Kuo-Ming Wu | 2023-08-01 |
| 11705360 | Image sensor with dual trench isolation structure | Cheng-Hsien Chou, Sheng-Chau Chen, Tzu-Jui Wang | 2023-07-18 |
| 11705470 | Image sensor scheme for optical and electrical improvement | Cheng-Hsien Chou, Cheng-Yuan Tsai, Keng-Yu Chou, Yeur-Luen Tu | 2023-07-18 |
| 11682652 | Notched wafer and bonding support structure to improve wafer stacking | Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-06-20 |
| 11652124 | Isolation structure having an air gap to reduce pixel crosstalk | Tsung-Wei Huang, Chao-Ching Chang, Yun-Wei Cheng, Chih-Lung CHENG, Yen-Chang Chen +4 more | 2023-05-16 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2023-03-21 |
| 11581254 | Three dimensional MIM capacitor having a comb structure and methods of making the same | Paul Yang, Tsun-Kai Tsao, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-02-14 |