Issued Patents 2023
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11828278 | Air compressor | Wen-San Chou | 2023-11-28 |
| 11815080 | Piston of cylinder of air compressor | Wen-San Chou | 2023-11-14 |
| 11767836 | Air compressor | Wen-San Chou | 2023-09-26 |
| 11761437 | Piston of air compressor | Wen-San Chou | 2023-09-19 |
| 11745451 | Device of inflating and repairing broken tire and method of using the same | Wen-San Chou | 2023-09-05 |
| 11749760 | Composite etch stop layers for sensor devices | Cheng-Han Lin, Chao-Ching Chang, Yi-Ming Lin, Yen-Ting Chou, Yen-Chang Chen +1 more | 2023-09-05 |
| 11735617 | Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same | Sheng-Chau Chen, Min-Feng Kao | 2023-08-22 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Sheng-Chau Chen, Cheng-Yuan Tsai, Kuo-Ming Wu | 2023-08-01 |
| 11705470 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Yuan Tsai, Keng-Yu Chou, Yeur-Luen Tu | 2023-07-18 |
| 11705360 | Image sensor with dual trench isolation structure | Sheng-Chau Chen, Tzu-Jui Wang, Sheng-Chan Li | 2023-07-18 |
| 11682652 | Notched wafer and bonding support structure to improve wafer stacking | Sheng-Chan Li, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-06-20 |
| 11670539 | Method of making a semiconductor arrangement | Ming-Che Lee, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-06-06 |
| 11664411 | Semiconductor structure having integrated inductor therein | Ming-Che Lee, Sheng-Chau Chen, I-Nan Chen, Cheng-Yuan Tsai | 2023-05-30 |
| D985623 | Air compressor | Wen-San Chou | 2023-05-09 |
| 11609138 | Air compressor having pressure gauge | Wen-San Chou | 2023-03-21 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2023-03-21 |
| 11609140 | Display structure of pressure gauge of air compressor | Wen-San Chou | 2023-03-21 |
| 11600647 | Absorption enhancement structure to increase quantum efficiency of image sensor | Tsun-Kai Tsao, Jiech-Fun Lu | 2023-03-07 |
| 11587908 | 3DIC structure and methods of forming | Kuo-Ming Wu, Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen | 2023-02-21 |
| 11548333 | Check joint structure for connection of air nozzle of tire and connection hose of air compressor | Wen-San Chou | 2023-01-10 |
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Hau-Yi Hsiao, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-01-10 |
| 11545395 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao | 2023-01-03 |