Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Kuo-Ming Wu, Ming-Che Lee, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-01-10 |
| 11545395 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2023-01-03 |