Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855158 | Semiconductor device structure having a gate structure and overlying dielectric layer | Hong-Shyang Wu | 2023-12-26 |
| 11848321 | Semiconductor device for providing spike voltage protection and manufacturing method thereof | Hong-Shyang Wu | 2023-12-19 |
| 11842992 | Seal ring structures and methods of forming same | Kuan-Liang Liu, Wen-De Wang, Yung-Lung Lin | 2023-12-12 |
| 11832496 | Color display with color filter layer comprising two-dimensional photonic crystals formed in a dielectric layer | Hong-Shyang Wu | 2023-11-28 |
| 11728374 | Semiconductor device including a capacitor | Hong-Yang CHEN, Tian Sheng Lin, Yi-Cheng Chiu, Hung-Chou Lin, Yi-Min Chen +1 more | 2023-08-15 |
| 11721758 | Semiconductor structure and associated fabricating method | Jia-Rui Lee, Yi-Chun Lin | 2023-08-08 |
| 11715674 | Trim wall protection method for multi-wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-08-01 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Sheng-Chan Li | 2023-03-21 |
| 11587908 | 3DIC structure and methods of forming | Yung-Lung Lin, Zhi-Yang Wang, Sheng-Chau Chen, Cheng-Hsien Chou | 2023-02-21 |
| 11552066 | Protective wafer grooving structure for wafer thinning and methods of using the same | Ming-Che Lee, Hau-Yi Hsiao, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2023-01-10 |
| 11545395 | Techniques for wafer stack processing | Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Hau-Yi Hsiao | 2023-01-03 |
| 11545443 | Method for forming hybrid-bonding structure | Kuan-Liang Liu, Pao-Tung Chen | 2023-01-03 |