Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646247 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng | 2023-05-09 |
| 11600653 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu | 2023-03-07 |
| 11552027 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Yi-Shin Chu +1 more | 2023-01-10 |
| 11545443 | Method for forming hybrid-bonding structure | Kuo-Ming Wu, Kuan-Liang Liu | 2023-01-03 |