Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855237 | Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof | Jhy-Jyi Sze, Sin-Yi Jiang, Yin-Kai Liao, Hsiang-Lin Chen, Kuan-Chieh Huang | 2023-12-26 |
| 11848345 | Image sensor with passivation layer for dark current reduction | Hsiang-Lin Chen, Yin-Kai Liao, Sin-Yi Jiang, Kuan-Chieh Huang, Jhy-Jyi Sze | 2023-12-19 |
| 11824254 | Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit | Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang | 2023-11-21 |
| 11756936 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen +1 more | 2023-09-12 |
| 11756862 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Ping-Tzu Chen | 2023-09-12 |
| 11600737 | Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof | Jhy-Jyi Sze, Sin-Yi Jiang, Yin-Kai Liao, Hsiang-Lin Chen, Kuan-Chieh Huang | 2023-03-07 |
| 11552027 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Pao-Tung Chen +1 more | 2023-01-10 |