Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854959 | Metal-insulator-metal device with improved performance | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Hua Lin | 2023-12-26 |
| 11791332 | Stacked semiconductor device and method | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu | 2023-10-17 |
| 11764129 | Method of forming shield structure for backside through substrate vias (TSVS) | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Wei-Tao Tsai | 2023-09-19 |
| 11756920 | Semiconductor structure and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Zheng-Xun Li | 2023-09-12 |
| 11756862 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen | 2023-09-12 |
| 11756936 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Yi-Shin Chu, Ping-Tzu Chen +1 more | 2023-09-12 |
| 11705449 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2023-07-18 |
| 11694997 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Ping-Tzu Chen, Min-Feng Kao | 2023-07-04 |
| 11646308 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2023-05-09 |