Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756862 | Oversized via as through-substrate-via (TSV) stop layer | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu | 2023-09-12 |
| 11756936 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu +1 more | 2023-09-12 |
| 11694997 | Backside contact for thermal displacement in a multi-wafer stacked integrated circuit | Hsing-Chih Lin, Min-Feng Kao | 2023-07-04 |